Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee.
By: Lau, John H
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Contributor(s): Lee, S. W. Ricky.
Material type: 
BookPublisher: New York : McGraw-Hill, c2001Description: xxiii, 565 p. : ill. ; 24 cm.ISBN: 0071363270.Subject(s): Microelectronic packaging | Integrated circuits -- Design and construction -- Cost control | Semiconductors -- Junctions | Printed circuitsDDC classification: 621.381046 Online resources: Contributor biographical information | Table of contents | Publisher description
| Item type | Current location | Call number | Copy number | Status | Date due | Barcode | Item holds |
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Books
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Central Library, KUET General Stacks | 621.381046 LAU (Browse shelf) | 1 | Available | 3010032505 |
Total holds: 0
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