Advanced interconnects for ULSI technology / (Record no. 11667)
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| 000 -LEADER | |
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| fixed length control field | 05170cam a2200841Ka 4500 |
| 001 - CONTROL NUMBER | |
| control field | ocn778448543 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | OCoLC |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20171224113843.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS--GENERAL INFORMATION | |
| fixed length control field | m o d |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr cnu---unuuu |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 120228s2012 nju ob 001 0 eng d |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | N$T |
| Language of cataloging | eng |
| Description conventions | pn |
| Transcribing agency | N$T |
| Modifying agency | EBLCP |
| -- | DG1 |
| -- | YDXCP |
| -- | CDX |
| -- | COO |
| -- | OCLCQ |
| -- | IDEBK |
| -- | OCLCQ |
| -- | AU@ |
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| 019 ## - | |
| -- | 779617142 |
| -- | 817082211 |
| -- | 819896613 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781119963240 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 1119963249 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781119963677 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 1119963672 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 1280590807 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781280590801 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Cancelled/invalid ISBN | 9780470662540 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Cancelled/invalid ISBN | 0470662549 |
| 024 8# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 9786613620637 |
| 029 1# - (OCLC) | |
| OCLC library identifier | AU@ |
| System control number | 000050204433 |
| 029 1# - (OCLC) | |
| OCLC library identifier | DEBBG |
| System control number | BV041829362 |
| 029 1# - (OCLC) | |
| OCLC library identifier | DEBSZ |
| System control number | 431101108 |
| 029 1# - (OCLC) | |
| OCLC library identifier | DKDLA |
| System control number | 820120-katalog:000600718 |
| 029 1# - (OCLC) | |
| OCLC library identifier | GBVCP |
| System control number | 790036215 |
| 029 1# - (OCLC) | |
| OCLC library identifier | NZ1 |
| System control number | 15900549 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (OCoLC)778448543 |
| Canceled/invalid control number | (OCoLC)779617142 |
| -- | (OCoLC)817082211 |
| -- | (OCoLC)819896613 |
| 037 ## - SOURCE OF ACQUISITION | |
| Stock number | 10.1002/9781119963677 |
| Source of stock number/acquisition | Wiley InterScience |
| Note | http://www3.interscience.wiley.com |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7874.53 |
| Item number | .A39 2012eb |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | COM |
| Subject category code subdivision | 036000 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 008030 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 008050 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.39/5 |
| Edition number | 23 |
| 049 ## - LOCAL HOLDINGS (OCLC) | |
| Holding library | MAIN |
| 245 00 - TITLE STATEMENT | |
| Title | Advanced interconnects for ULSI technology / |
| Statement of responsibility, etc | [edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication, distribution, etc | Hoboken, NJ : |
| Name of publisher, distributor, etc | Wiley, |
| Date of publication, distribution, etc | 2012. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | "This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- |
| -- | Provided by publisher. |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc | Includes bibliographical references and index. |
| 588 0# - | |
| -- | Print version record. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Interconnects (Integrated circuit technology) |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Integrated circuits |
| General subdivision | Ultra large scale integration. |
| 650 #4 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Integrated circuits |
| General subdivision | Ultra large scale integration. |
| 650 #4 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Interconnects (Integrated circuit technology) |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Electronics |
| -- | Circuits |
| -- | VLSI & ULSI. |
| Source of heading or term | bisacsh |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | COMPUTERS |
| General subdivision | Logic Design. |
| Source of heading or term | bisacsh |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Electronics |
| -- | Circuits |
| -- | Logic. |
| Source of heading or term | bisacsh |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Integrated circuits |
| General subdivision | Ultra large scale integration. |
| Source of heading or term | fast |
| -- | (OCoLC)fst00975596 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Interconnects (Integrated circuit technology) |
| Source of heading or term | fast |
| -- | (OCoLC)fst00976051 |
| 655 #4 - INDEX TERM--GENRE/FORM | |
| Genre/form data or focus term | Electronic books. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Baklanov, Mikhail. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Ho, P. S. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Zschech, Ehrenfried. |
| 773 0# - HOST ITEM ENTRY | |
| Title | EBL |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Print version: |
| Title | Advanced interconnects for ULSI technology. |
| Place, publisher, and date of publication | Hoboken, NJ : Wiley, 2012 |
| International Standard Book Number | 9780470662540 |
| Record control number | (DLC) 2011038787 |
| -- | (OCoLC)757478544 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://onlinelibrary.wiley.com/book/10.1002/9781119963677 |
| Public note | Wiley Online Library |
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